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Title Business of Intellectual Property Asia Forum 2018
e-Date 06 - 07 December 2018
Venue Hong Kong Convention and Exhibition Centre
Organiser Hong Kong Trade Development Council
Tel (852) 1830 688
Fax (852) 2824 0249
E-mail bipasia@hktdc.org
Website http://www.hktdc.com/ncs/bip2018/en/main/index.html
Description